4900P SAC305 Solder Paste is a no-clean solder paste made from a blend of high-purity, non-recycled tin, silver and copper metal powder mixed with a no-clean flux. This halogen-free and lead-free solder paste is designed for extreme flux activity and the enhanced printing requirements of ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.
900P is the best lead-free solder paste for facilitating high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.
Features:
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Repeatable and consistent printing characteristics
- Long stencil and tack life facilitate high speed printing
- Excellent wettability
- Suitable for air or nitrogen atmospheres
- Medium-soft, non-cracking residues
Specifications:
- Type: Solder Paste
- Composition: Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4)
- Melting Point: 423 ~ 430°F (217 ~ 221°C)
- Flux Type: No-Clean
- Process: Lead Free
- Form: Syringe, 0.88 oz (25g)
- Shelf Life: 24 Months
- Shelf Life Start: Date of Manufacture
- Storage/Refrigeration Temperature: 39°F ~ 50°F (4°C ~ 10°C)
