4870–4875 Sn60/Pb40 No-Clean Solder Wire is electronics grade solder wire. The 60/40 solder uses a classic tin-to-lead alloy ratio, which is complemented by a no-clean, synthetically refined, spatter-proof resin flux core. Our 60/40 tin-lead solder wire meets J-STD-004B, ASTM B 32 and J-STD-006C specifications. It melts at a slightly higher temperature, and over a wider temperature range, than classic 63/37 solder. It is the best 60/40 solder for creating robust and reliable joints that are highly resistant to whisker formation.
These leaded solders achieve a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, resulting in a top-grade solder wire.
Features:
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B for REL0
- Particle size Type 3 (80% min. between 25-45 µm)
- No-clean
- Excellent 12 mil (0.30 mm) fine pitch printing capability
- Long operational life—non-slumping
- Good wettability
- Halogen-free
Specifications:
- Leaded / Lead Free: Leaded
- Solder Alloy: 60, 40 Sn, Pb
- External Diameter - Imperial: 0.032"
- Weight - Metric: 18g
- Flux Type: No Clean and Rosin Flux
- External Diameter - Metric: 0.81mm
- Melting Temperature: 24°C
