4860P – Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no-clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)
Sn63/pb37 solder paste is designed for use in high-speed printing and is an ideal choice for SMT solder paste printers. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.
Features:
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Non-corrosive
- Non-conductive residue
- Halide-free
- Good wettability
- Type 3 (25-45 µm)
Specifications:
- Type: Solder Paste
- Composition Sn63Pb37 (63/37)
- Melting Point: 361°F (183°C)
- Flux Type: No-Clean
- Mesh Type: 3
- Process: Leaded
- Form: Syringe, 1.23 oz (35g), 10cc
- Shelf Life: 24 Months
- Shelf Life Start: Date of Manufacture
- Storage/Refrigeration Temperature: 39°F ~ 50°F (4°C ~ 10°C)
