4880–4888 Sn63/Pb37 RA Solder Wire is electronics grade solder wire. This 63/37 solder uses the eutectic tin-to-lead alloy ratio, which is complemented with an RA-like flux core. This tin-lead solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.
This 63/37 rosin core solder achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.
Features:
- Eutectic alloy (liquidus = solidus temperature)
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Rosin-activated flux
- Fast wetting
- Fast flowing
- Non-corrosive residue
- Non-conductive residue
Specifications:
- Type: Wire Solder
- Composition: Sn63Pb37 (63/37)
- Diameter: 0.050" (1.27mm)
- Melting Point: 361°F (183°C)
- Flux Type: Rosin Activated (RA)
- Wire Gauge: 16 AWG, 18 SWG
- Process: Leaded
- Form: Spool, 1 lb (454 g)
- Shelf Life: 60 Months
- Shelf Life Start: Date of Manufacture
- Storage/Refrigeration Temperature: 50°F ~ 86°F (10°C ~ 30°C)
