4901 Sn99 No-Clean Solder Wire is a solder wire for electronics. It uses a high-purity eutectic Sn99.3/Cu0.7 alloy, complemented by a no-clean, synthetically refined, spatter-proof resin flux core. 4901 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications.
4901 lead-free solder achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.
Features:
- Eutectic alloy (liquidus = solidus temperature)
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Resin spreads like rosin-activated flux
- Virtually non-spattering
- Non-corrosive
- Non-conductive
- Halide-free
- Suitable for Use in Food Facilities as a Non-Food Chemical
Specifications:
- Type: Wire Solder
- Composition: Sn99.3Cu0.7 (99.3/0.7)
- Diameter: 0.032" (0.81mm)
- Melting Point: 442°F (227°C)
- Flux Type: No-Clean
- Wire Gauge: 20 AWG, 21 SWG
- Process: Lead Free
- Form: Spool, 4 oz (113.40g)
- Shelf Life: 60 Months
- Storage/Refrigeration Temperature: 50°F ~ 86°F (10°C ~ 30°C)
